EP2C20F484I7N
BGA, BGA484,22X22,40Call for availability
Manufactured by:
Mfr Part#: EP2C20F484I7N
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA484,22X22,40
PACKAGE EQUIVALENCE CODE: BGA484,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO REQUIRES 3.3 SUPPLY
JESD-30 CODE: S-PBGA-B484
JESD-609 CODE: E1
LENGTH: 23 MM
MANUFACTURER: ALTERA CORPORATION
MANUFACTURER PART NUMBER: EP2C20F484I7N
NUMBER OF CLBS: 1196
NUMBER OF INPUTS: 315
NUMBER OF LOGIC CELLS: 18752
NUMBER OF OUTPUTS: 299
NUMBER OF TERMINALS: 484
ORGANIZATION: 1196 CLBS
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA484,22X22,40
PACKAGE EQUIVALENCE CODE: BGA484,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 484
POWER SUPPLIES: 1.2,1.5/3.3,3.3 V
PROGRAMMABLE LOGIC TYPE: FIELD PROGRAMMABLE GATE ARRAY
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.6 MM
SUBCATEGORY: FIELD PROGRAMMABLE GATE ARRAYS
SUPPLY VOLTAGE-MAX: 1.25 V
SUPPLY VOLTAGE-MIN: 1.15 V
SUPPLY VOLTAGE-NOM: 1.2 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TERMINAL FINISH: TIN/SILVER/COPPER (SN/AG/CU)
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 40
WIDTH: 23 MM
Related Products
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .