5353-1J

5353-1J

DIP, DIP18,.3

Call for availability

Manufactured by:

AMD

Mfr Part#:  5353-1J

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  75 NS

JESD-30 CODE:  R-XDIP-T18

JESD-609 CODE:  E0

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  5353-1J

MEMORY DENSITY:  4.096 KBIT

MEMORY IC TYPE:  OTP ROM

MEMORY WIDTH:  4

NUMBER OF TERMINALS:  18

NUMBER OF WORDS:  1.024 K

NUMBER OF WORDS CODE:  1000

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

ORGANIZATION:  1KX4

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  OTP ROMS

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  TTL

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

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