AM188ES-20KI\W

AM188ES-20KI\W

QFP, QFP100,.7X.9

Call for availability

Manufactured by:

AMD

Mfr Part#:  AM188ES-20KI\W

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP100,.7X.9

PACKAGE EQUIVALENCE CODE:  QFP100,.7X.9

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  20

BIT SIZE:  16

CLOCK FREQUENCY-MAX:  20 MHZ

DAC CHANNELS:  NO

DMA CHANNELS:  YES

EXTERNAL DATA BUS WIDTH:  8

HAS ADC:  NO

JESD-30 CODE:  R-PQFP-G100

JESD-609 CODE:  E0

LENGTH:  20 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM188ES-20KIW

NUMBER OF I/O LINES:  32

NUMBER OF TERMINALS:  100

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  NO

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP100,.7X.9

PACKAGE EQUIVALENCE CODE:  QFP100,.7X.9

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

PIN COUNT:  100

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  3.35 MM

SPEED:  20 MHZ

SUBCATEGORY:  MICROPROCESSORS

SUPPLY CURRENT-MAX:  118 MA

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*