AM26LS30DMB

AM26LS30DMB

DIP, DIP16,.3

Call for availability

Manufactured by:

AMD

Mfr Part#:  AM26LS30DMB

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP16,.3

PACKAGE EQUIVALENCE CODE:  DIP16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  PROGRAMMABLE SLEW RATE

DIFFERENTIAL OUTPUT:  YES

DRIVER NUMBER OF BITS:  4

HIGH LEVEL INPUT CURRENT-MAX:  40 ΜA

INPUT CHARACTERISTICS:  STANDARD

INTERFACE IC TYPE:  LINE DRIVER

INTERFACE STANDARD:  EIA-422; EIA-423

JESD-30 CODE:  R-GDIP-T16

JESD-609 CODE:  E0

LENGTH:  22.86 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM26LS30DMB

NEGATIVE SUPPLY VOLTAGE-NOM:  -5 V

NUMBER OF FUNCTIONS:  4

NUMBER OF TERMINALS:  16

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

OUT SWING-MIN:  2 V

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT POLARITY:  COMPLEMENTARY

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP16,.3

PACKAGE EQUIVALENCE CODE:  DIP16,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  16

POWER SUPPLIES:  5/+-5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RECEIVE DELAY-MAX:  0 NS

SCREENING LEVEL:  MIL-STD-883 CLASS B (MODIFIED)

SEATED HEIGHT-MAX:  5.08 MM

SUBCATEGORY:  LINE DRIVER OR RECEIVERS

SUPPLY CURRENT-MAX:  30 MA

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  BIPOLAR

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

TRANSMIT DELAY-MAX:  300 NS

WIDTH:  7.62 MM

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