ACCESS TIME-MAX:  35 NS

JESD-30 CODE:  R-GDIP-T18

JESD-609 CODE:  E0

LENGTH:  22.86 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM27S185ADC

MEMORY DENSITY:  8.192 KBIT

MEMORY IC TYPE:  OTP ROM

MEMORY WIDTH:  4

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  18

NUMBER OF WORDS:  2.048 K

NUMBER OF WORDS CODE:  2000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  75 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  2KX4

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  18

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.08 MM

SUBCATEGORY:  OTP ROMS

SUPPLY CURRENT-MAX:  150 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.25 V

SUPPLY VOLTAGE-MIN (VSUP):  4.75 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  BIPOLAR

TEMPERATURE GRADE:  COMMERCIAL EXTENDED

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  7.62 MM