AM29DL800BB70EI

AM29DL800BB70EI

TSOP1, TSSOP48,.8,20

Call for availability

Manufactured by:

AMD

Mfr Part#:  AM29DL800BB70EI

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP1

PACKAGE DESCRIPTION:  TSOP1, TSSOP48,.8,20

PACKAGE EQUIVALENCE CODE:  TSSOP48,.8,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PART PACKAGE CODE:  TSOP1

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  70 NS

ADDITIONAL FEATURE:  MINIMUM 1000K PROGRAM/ERASE CYCLES; CAN ALSO BE CONFIGURED AS 512K X 16

ALTERNATE MEMORY WIDTH:  8

BOOT BLOCK:  BOTTOM

COMMAND USER INTERFACE:  YES

DATA POLLING:  YES

JESD-30 CODE:  R-PDSO-G48

JESD-609 CODE:  E0

LENGTH:  18.4 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM29DL800BB70EI

MEMORY DENSITY:  8.3886 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF SECTORS/SIZE:  2,4,2,14

NUMBER OF TERMINALS:  48

NUMBER OF WORDS:  524.288 K

NUMBER OF WORDS CODE:  512000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  512KX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP1

PACKAGE DESCRIPTION:  TSOP1, TSSOP48,.8,20

PACKAGE EQUIVALENCE CODE:  TSSOP48,.8,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  TSOP1

PIN COUNT:  48

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

READY/BUSY:  YES

SEATED HEIGHT-MAX:  1.2 MM

SECTOR SIZE:  16K,8K,32K,64K

STANDBY CURRENT-MAX:  5 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  45 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TOGGLE BIT:  YES

TYPE:  NOR TYPE

WIDTH:  12 MM

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