AM29LV800BB120EC

AM29LV800BB120EC

TSOP1

Call for availability

Manufactured by:

AMD

Mfr Part#:  AM29LV800BB120EC

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP1

PACKAGE DESCRIPTION:  TSOP1,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PART PACKAGE CODE:  TSOP1

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  120 NS

ADDITIONAL FEATURE:  CONFG AS 512K X 16; BOTTOM BOOT BLOCK

ALTERNATE MEMORY WIDTH:  8

JESD-30 CODE:  R-PDSO-G48

LENGTH:  18.4 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM29LV800BB120EC

MEMORY DENSITY:  16.7772 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  48

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  512000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  512KX16

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP1

PACKAGE DESCRIPTION:  TSOP1,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  TSOP1

PIN COUNT:  48

PROGRAMMING VOLTAGE:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

WIDTH:  12 MM

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