CS5536ADB1

CS5536ADB1

BGA

Call for availability

Manufactured by:

AMD

Mfr Part#:  CS5536ADB1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  ALSO OPERATES AT 1.25 V AND 1.4 TYP

JESD-30 CODE:  S-PBGA-B208

LENGTH:  23 MM

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  CS5536ADB1

NUMBER OF TERMINALS:  208

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PIN COUNT:  208

SEATED HEIGHT-MAX:  2.33 MM

SUPPLY VOLTAGE-MAX:  1.44 V

SUPPLY VOLTAGE-MIN:  1.16 V

SUPPLY VOLTAGE-NOM:  1.2 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

WIDTH:  23 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR CIRCUIT

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*