ADDRESS BUS WIDTH:  0

BOUNDARY SCAN:  NO

BUS COMPATIBILITY:  8080; 8085; 8086; 8088

CLOCK FREQUENCY-MAX:  3.125 MHZ

COMMUNICATION PROTOCOL:  ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC

DATA ENCODING/DECODING METHOD:  NRZ

DATA TRANSFER RATE-MAX:  0.0078125 MBPS

EXTERNAL DATA BUS WIDTH:  8

JESD-30 CODE:  R-CDIP-T40

JESD-609 CODE:  E0

LENGTH:  52.324 MM

LOW POWER MODE:  NO

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  MD8251AB

NUMBER OF DMA CHANNELS:  0

NUMBER OF I/O LINES:  0

NUMBER OF SERIAL I/OS:  1

NUMBER OF TERMINALS:  40

ON CHIP DATA RAM WIDTH:  0

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP28,.6

PACKAGE EQUIVALENCE CODE:  DIP28,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  40

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  0

SCREENING LEVEL:  MIL-STD-883 CLASS B (MODIFIED)

SEATED HEIGHT-MAX:  5.715 MM

SUBCATEGORY:  SERIAL IO/COMMUNICATION CONTROLLERS

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  NMOS

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  15.24 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, SERIAL