PAL16R4CJ

PAL16R4CJ

DIP, DIP20,.3

Call for availability

Manufactured by:

AMD

Mfr Part#:  PAL16R4CJ

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP20,.3

PACKAGE EQUIVALENCE CODE:  DIP20,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ARCHITECTURE:  PAL-TYPE

JESD-30 CODE:  R-XDIP-T20

JESD-609 CODE:  E0

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  PAL16R4CJ

NUMBER OF INPUTS:  12

NUMBER OF OUTPUTS:  8

NUMBER OF PRODUCT TERMS:  64

NUMBER OF TERMINALS:  20

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

OUTPUT FUNCTION:  REGISTERED

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP20,.3

PACKAGE EQUIVALENCE CODE:  DIP20,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

POWER SUPPLIES:  5 V

PROGRAMMABLE LOGIC TYPE:  EE PLD

PROPAGATION DELAY:  35 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  PROGRAMMABLE LOGIC DEVICES

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  TTL

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

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