PPC405EP-3LB266C
BGA, BGA385,23X23,50Call for availability
Mfr Part#: PPC405EP-3LB266C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA385,23X23,50
PACKAGE EQUIVALENCE CODE: BGA385,23X23,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO REQUIRES 3.3V SUPPLY
ADDRESS BUS WIDTH: 0
BIT SIZE: 32
BOUNDARY SCAN: YES
CLOCK FREQUENCY-MAX: 100 MHZ
EXTERNAL DATA BUS WIDTH: 0
FORMAT: FIXED POINT
INTEGRATED CACHE: YES
JESD-30 CODE: S-PBGA-B385
LENGTH: 31 MM
LOW POWER MODE: YES
MANUFACTURER: APPLIED MICRO CIRCUITS CORPORATION
MANUFACTURER PART NUMBER: PPC405EP-3LB266C
NUMBER OF TERMINALS: 385
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA385,23X23,50
PACKAGE EQUIVALENCE CODE: BGA385,23X23,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 385
POWER SUPPLIES: 1.8,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.65 MM
SPEED: 266.66 MHZ
SUBCATEGORY: MICROPROCESSORS
SUPPLY VOLTAGE-MAX: 1.95 V
SUPPLY VOLTAGE-MIN: 1.65 V
SUPPLY VOLTAGE-NOM: 1.8 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 31 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC
Related Products
Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .