S19202CBI30

S19202CBI30

BGA

Call for availability

Manufactured by:

APPLIED MICRO CIRCUITS

Mfr Part#:  S19202CBI30

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

APPLICATIONS:  ATM;SDH;SONET

JESD-30 CODE:  S-CBGA-B624

LENGTH:  32.5 MM

MANUFACTURER:  APPLIED MICRO CIRCUITS CORPORATION

MANUFACTURER PART NUMBER:  S19202CBI30

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  624

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  624

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.672 MM

SUPPLY VOLTAGE-NOM:  1.8 V

SURFACE MOUNT:  YES

TELECOM IC TYPE:  SUPPORT CIRCUIT

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  32.5 MM

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