S3056TT

S3056TT

HLFQFP

Call for availability

Manufactured by:

APPLIED MICRO CIRCUITS

Mfr Part#:  S3056TT

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HLFQFP

PACKAGE DESCRIPTION:  HLFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PQFP-G48

JESD-609 CODE:  E0

LENGTH:  7 MM

MANUFACTURER:  APPLIED MICRO CIRCUITS CORPORATION

MANUFACTURER PART NUMBER:  S3056TT

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  48

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HLFQFP

PACKAGE DESCRIPTION:  HLFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  48

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  BICMOS

TELECOM IC TYPE:  CLOCK RECOVERY CIRCUIT

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  7 MM

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*