S3057TB

S3057TB

LBGA

Call for availability

Manufactured by:

APPLIED MICRO CIRCUITS

Mfr Part#:  S3057TB

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

APPLICATIONS:  ATM;SDH;SONET

JESD-30 CODE:  S-PBGA-B156

JESD-609 CODE:  E0

LENGTH:  21 MM

MANUFACTURER:  APPLIED MICRO CIRCUITS CORPORATION

MANUFACTURER PART NUMBER:  S3057TB

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  156

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -20 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  156

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.65 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  BICMOS

TELECOM IC TYPE:  TRANSCEIVER

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  21 MM

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*