S3063TT

S3063TT

HLFQFP

Call for availability

Manufactured by:

APPLIED MICRO CIRCUITS

Mfr Part#:  S3063TT

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HLFQFP

PACKAGE DESCRIPTION:  HLFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

APPLICATIONS:  ATM;SDH;SONET

JESD-30 CODE:  S-PQFP-G100

LENGTH:  14 MM

MANUFACTURER:  APPLIED MICRO CIRCUITS CORPORATION

MANUFACTURER PART NUMBER:  S3063TT

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  100

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HLFQFP

PACKAGE DESCRIPTION:  HLFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

PIN COUNT:  100

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TELECOM IC TYPE:  TRANSMITTER

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

WIDTH:  14 MM

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