ATTACHMENT METHOD: SMD PAD
CATEGORY: FANS, THERMAL MANAGEMENT
FAMILY: THERMAL - HEAT SINKS
HEIGHT OFF BASE (HEIGHT OF FIN): 0.390" (9.91MM)
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
LENGTH: 0.320" (8.13MM)
MANUFACTURER: ASSMANN WSW COMPONENTS
MANUFACTURER PART NUMBER: V-1100-SMD/B-L
MANUFACTURER STANDARD LEAD TIME: 20 WEEKS
MATERIAL: COPPER
MATERIAL FINISH: TIN
MOISTURE SENSITIVITY LEVEL (MSL): 1 (UNLIMITED)
PACKAGE COOLED: D²PAK, TO-252
SHAPE: RECTANGULAR
STANDARD PACKAGE: 500
THERMAL RESISTANCE @ NATURAL: 25°C/W
TYPE: TOP MOUNT
WIDTH: 0.790" (20.07MM)
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