AT24C256U2-10UI-2.7
VFBGA, BGA8,2X4,30Call for availability
Mfr Part#: AT24C256U2-10UI-2.7
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: VFBGA
PACKAGE DESCRIPTION: VFBGA, BGA8,2X4,30
PACKAGE EQUIVALENCE CODE: BGA8,2X4,30
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CLOCK FREQUENCY-MAX (FCLK): 1 MHZ
DATA RETENTION TIME-MIN: 40
ENDURANCE: 1000000 WRITE/ERASE CYCLES
I2C CONTROL BYTE: 10100DDR
JESD-30 CODE: R-PBGA-B8
JESD-609 CODE: E0
LENGTH: 3.73 MM
MANUFACTURER: ATMEL CORPORATION
MANUFACTURER PART NUMBER: AT24C256U2-10UI-2.7
MEMORY DENSITY: 262.144 KBIT
MEMORY IC TYPE: EEPROM
MEMORY WIDTH: 8
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 8
NUMBER OF WORDS: 32.768 K
NUMBER OF WORDS CODE: 32000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 32KX8
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: VFBGA
PACKAGE DESCRIPTION: VFBGA, BGA8,2X4,30
PACKAGE EQUIVALENCE CODE: BGA8,2X4,30
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PARALLEL/SERIAL: SERIAL
PART PACKAGE CODE: BGA
PEAK REFLOW TEMPERATURE (CEL): 240
PIN COUNT: 8
POWER SUPPLIES: 3/5 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1 MM
SERIAL BUS TYPE: I2C
STANDBY CURRENT-MAX: 500 NA
SUBCATEGORY: EEPROMS
SUPPLY CURRENT-MAX: 3 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 2.7 V
SUPPLY VOLTAGE-NOM (VSUP): 3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: BALL
TERMINAL PITCH: 750 ΜM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 2.35 MM
WRITE CYCLE TIME-MAX (TWC): 10 MS
WRITE PROTECTION: HARDWARE
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