AT24C256U2-10UI-2.7

AT24C256U2-10UI-2.7

VFBGA, BGA8,2X4,30

Call for availability

Manufactured by:

ATMEL

Mfr Part#:  AT24C256U2-10UI-2.7

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA, BGA8,2X4,30

PACKAGE EQUIVALENCE CODE:  BGA8,2X4,30

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CLOCK FREQUENCY-MAX (FCLK):  1 MHZ

DATA RETENTION TIME-MIN:  40

ENDURANCE:  1000000 WRITE/ERASE CYCLES

I2C CONTROL BYTE:  10100DDR

JESD-30 CODE:  R-PBGA-B8

JESD-609 CODE:  E0

LENGTH:  3.73 MM

MANUFACTURER:  ATMEL CORPORATION

MANUFACTURER PART NUMBER:  AT24C256U2-10UI-2.7

MEMORY DENSITY:  262.144 KBIT

MEMORY IC TYPE:  EEPROM

MEMORY WIDTH:  8

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  32KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA, BGA8,2X4,30

PACKAGE EQUIVALENCE CODE:  BGA8,2X4,30

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  8

POWER SUPPLIES:  3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1 MM

SERIAL BUS TYPE:  I2C

STANDBY CURRENT-MAX:  500 NA

SUBCATEGORY:  EEPROMS

SUPPLY CURRENT-MAX:  3 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  750 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  2.35 MM

WRITE CYCLE TIME-MAX (TWC):  10 MS

WRITE PROTECTION:  HARDWARE

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