AT45DB081B-TU
TSOP1, TSSOP28,.53,22Call for availability
Mfr Part#: AT45DB081B-TU
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP1
PACKAGE DESCRIPTION: TSOP1, TSSOP28,.53,22
PACKAGE EQUIVALENCE CODE: TSSOP28,.53,22
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PART PACKAGE CODE: TSOP1
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ORGANIZED AS 4096 PAGES OF 264 BYTES EACH
CLOCK FREQUENCY-MAX (FCLK): 20 MHZ
JESD-30 CODE: R-PDSO-G28
JESD-609 CODE: E3
LENGTH: 11.8 MM
MANUFACTURER: ATMEL CORPORATION
MANUFACTURER PART NUMBER: AT45DB081B-TU
MEMORY DENSITY: 8.6508 MBIT
MEMORY IC TYPE: FLASH
MEMORY WIDTH: 8
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 28
NUMBER OF WORDS: 1.0813 M
NUMBER OF WORDS CODE: 1081344
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 1081344X8
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSOP1
PACKAGE DESCRIPTION: TSOP1, TSSOP28,.53,22
PACKAGE EQUIVALENCE CODE: TSSOP28,.53,22
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE
PARALLEL/SERIAL: SERIAL
PART PACKAGE CODE: TSOP1
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 28
POWER SUPPLIES: 3/3.3 V
PROGRAMMING VOLTAGE: 2.7 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.2 MM
SERIAL BUS TYPE: SPI
STANDBY CURRENT-MAX: 10 ΜA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 35 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 2.7 V
SUPPLY VOLTAGE-NOM (VSUP): 3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: MATTE TIN (SN)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 550 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 40
TYPE: NOR TYPE
WIDTH: 8 MM
WRITE PROTECTION: HARDWARE
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