AT91SAM9260-CU
LFBGA, BGA217,17X17,32Call for availability
Mfr Part#: AT91SAM9260-CU
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFBGA
PACKAGE DESCRIPTION: LFBGA, BGA217,17X17,32
PACKAGE EQUIVALENCE CODE: BGA217,17X17,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO OPERATES AT 3.3V SUPPLY
ADDRESS BUS WIDTH: 26
BIT SIZE: 32
CPU FAMILY: ARM9
CLOCK FREQUENCY-MAX: 50 MHZ
DAC CHANNELS: NO
DMA CHANNELS: YES
EXTERNAL DATA BUS WIDTH: 32
HAS ADC: YES
JESD-30 CODE: S-PBGA-B217
LENGTH: 15 MM
MANUFACTURER: ATMEL CORPORATION
MANUFACTURER PART NUMBER: AT91SAM9260-CU
NUMBER OF I/O LINES: 96
NUMBER OF TERMINALS: 217
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PWM CHANNELS: YES
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFBGA
PACKAGE DESCRIPTION: LFBGA, BGA217,17X17,32
PACKAGE EQUIVALENCE CODE: BGA217,17X17,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
PIN COUNT: 217
POWER SUPPLIES: 1.8,1.8/3.3,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 8192
ROM (WORDS): 32768
ROM PROGRAMMABILITY: FLASH
SEATED HEIGHT-MAX: 1.4 MM
SPEED: 210 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY VOLTAGE-MAX: 1.95 V
SUPPLY VOLTAGE-MIN: 1.65 V
SUPPLY VOLTAGE-NOM: 1.8 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: BOTTOM
WIDTH: 15 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROCONTROLLER, RISC
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