T-8207---BAL-DT

T-8207---BAL-DT

BGA

Call for availability

Manufactured by:

AVAGO TECHNOLOGIES

Mfr Part#:  T-8207---BAL-DT

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PBGA-B272

JESD-609 CODE:  E0

LENGTH:  27 MM

MANUFACTURER:  AVAGO TECHNOLOGIES

MANUFACTURER PART NUMBER:  T-8207---BAL-DT

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  272

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PEAK REFLOW TEMPERATURE (CEL):  225

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.54 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TELECOM IC TYPE:  ATM NETWORK INTERFACE

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  27 MM

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*