TMXF281553BAL-3C-DB
BGA, BGA456,26X26,50Call for availability
Manufactured by:
Mfr Part#: TMXF281553BAL-3C-DB
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA456,26X26,50
PACKAGE EQUIVALENCE CODE: BGA456,26X26,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: S-PBGA-B456
MANUFACTURER: AVAGO TECHNOLOGIES
MANUFACTURER PART NUMBER: TMXF281553BAL-3C-DB
NUMBER OF TERMINALS: 456
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA456,26X26,50
PACKAGE EQUIVALENCE CODE: BGA456,26X26,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: OTHER TELECOM ICS
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
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