TTSI4K32T3BAL

TTSI4K32T3BAL

BGA

Call for availability

Manufactured by:

AVAGO TECHNOLOGIES

Mfr Part#:  TTSI4K32T3BAL

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PBGA-B217

JESD-609 CODE:  E0

LENGTH:  23 MM

MANUFACTURER:  AVAGO TECHNOLOGIES

MANUFACTURER PART NUMBER:  TTSI4K32T3BAL

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  217

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PEAK REFLOW TEMPERATURE (CEL):  225

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.32 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TELECOM IC TYPE:  TIME SLOT ASSIGNER

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  23 MM

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