BS62LV1024TC70
TSSOP, TSSOP32,.8,20Call for availability
Mfr Part#: BS62LV1024TC70
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP32,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP32,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 70 NS
I/O TYPE: COMMON
JESD-30 CODE: R-PDSO-G32
JESD-609 CODE: E0
MANUFACTURER: BRILLIANCE SEMICONDUCTOR INC
MANUFACTURER PART NUMBER: BS62LV1024TC70
MEMORY DENSITY: 1.0486 MBIT
MEMORY IC TYPE: STANDARD SRAM
MEMORY WIDTH: 8
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF TERMINALS: 32
NUMBER OF WORDS: 131.072 K
NUMBER OF WORDS CODE: 128000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 128KX8
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP32,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP32,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PARALLEL/SERIAL: PARALLEL
POWER SUPPLIES: 3/5 V
QUALIFICATION STATUS: NOT QUALIFIED
STANDBY CURRENT-MAX: 300 NA
STANDBY VOLTAGE-MIN: 1.5 V
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 35 ΜA
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
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