BS62LV2006STCP70
TSSOP, TSSOP32,.56,20Call for availability
Mfr Part#: BS62LV2006STCP70
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP32,.56,20
PACKAGE EQUIVALENCE CODE: TSSOP32,.56,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 70 NS
I/O TYPE: COMMON
JESD-30 CODE: R-PDSO-G32
LENGTH: 11.8 MM
MANUFACTURER: BRILLIANCE SEMICONDUCTOR INC
MANUFACTURER PART NUMBER: BS62LV2006STCP70
MEMORY DENSITY: 2.0972 MBIT
MEMORY IC TYPE: STANDARD SRAM
MEMORY WIDTH: 8
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 32
NUMBER OF WORDS: 262.144 K
NUMBER OF WORDS CODE: 256000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 256KX8
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP32,.56,20
PACKAGE EQUIVALENCE CODE: TSSOP32,.56,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: TSOP
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 32
POWER SUPPLIES: 3/5 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.2 MM
STANDBY VOLTAGE-MIN: 1.5 V
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 43 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 2.4 V
SUPPLY VOLTAGE-NOM (VSUP): 3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 8 MM
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