PACKAGING:  T/R

CONSTRUCTION:  CHIP

JESD-609 CODE:  E3

MANUFACTURER:  CAL-CHIP ELECTRONICS

MANUFACTURER PART NUMBER:  RM10F5230CT

MANUFACTURER SERIES:  RM

MOUNTING FEATURE:  SURFACE MOUNT

OPERATING TEMPERATURE-MAX:  150 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  SMT, 0805

PACKAGE HEIGHT:  500 ΜM

PACKAGE LENGTH:  2 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  1.25 MM

PACKING METHOD:  TR

PBFREE CODE:  YES

RATED POWER DISSIPATION (P):  125 MW

RATED TEMPERATURE:  70 °C

RESISTANCE:  523 O

RESISTOR TYPE:  FIXED RESISTOR

SERIES:  RM

SIZE CODE:  0805

SUBCATEGORY:  FIXED RESISTOR

SURFACE MOUNT:  YES

TECHNOLOGY:  METAL GLAZE/THICK FILM

TEMPERATURE COEFFICIENT:  100 PPM/°C

TERMINAL FINISH:  MATTE TIN (SN) - WITH NICKEL (NI) BARRIER

TERMINAL SHAPE:  WRAPAROUND

TOLERANCE:  1 %

WORKING VOLTAGE:  150 V