IMP708SCUA

IMP708SCUA

TSSOP, TSSOP8,.19

Call for availability

Manufactured by:

DAILY SILVER IMP

Mfr Part#:  IMP708SCUA

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP8,.19

PACKAGE EQUIVALENCE CODE:  TSSOP8,.19

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADJUSTABLE THRESHOLD:  NO

JESD-30 CODE:  R-PDSO-G8

MANUFACTURER:  DAILY SILVER IMP MICROELECTRONICS CO LTD

MANUFACTURER PART NUMBER:  IMP708SCUA

NUMBER OF TERMINALS:  8

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP8,.19

PACKAGE EQUIVALENCE CODE:  TSSOP8,.19

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

POWER SUPPLIES:  1.1/5.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  POWER MANAGEMENT CIRCUITS

SUPPLY CURRENT-MAX (ISUP):  140 ΜA

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  635 ΜM

TERMINAL POSITION:  DUAL

THRESHOLD VOLTAGE-NOM:  +2.93V

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