IMP708SCUA
TSSOP, TSSOP8,.19Call for availability
Mfr Part#: IMP708SCUA
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP8,.19
PACKAGE EQUIVALENCE CODE: TSSOP8,.19
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADJUSTABLE THRESHOLD: NO
JESD-30 CODE: R-PDSO-G8
MANUFACTURER: DAILY SILVER IMP MICROELECTRONICS CO LTD
MANUFACTURER PART NUMBER: IMP708SCUA
NUMBER OF TERMINALS: 8
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP8,.19
PACKAGE EQUIVALENCE CODE: TSSOP8,.19
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
POWER SUPPLIES: 1.1/5.5 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: POWER MANAGEMENT CIRCUITS
SUPPLY CURRENT-MAX (ISUP): 140 ΜA
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 635 ΜM
TERMINAL POSITION: DUAL
THRESHOLD VOLTAGE-NOM: +2.93V
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