BU-61864F3-270
QFF, QFL72,1.0SQCall for availability
Mfr Part#: BU-61864F3-270
PACKAGE BODY MATERIAL: CERAMIC, METAL-SEALED COFIRED
PACKAGE CODE: QFF
PACKAGE DESCRIPTION: QFF, QFL72,1.0SQ
PACKAGE EQUIVALENCE CODE: QFL72,1.0SQ
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDRESS BUS WIDTH: 16
BOUNDARY SCAN: NO
CLOCK FREQUENCY-MAX: 20 MHZ
COMMUNICATION PROTOCOL: MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760; MCAIR; STANAG-3838
DATA ENCODING/DECODING METHOD: BIPH-LEVEL(MANCHESTER)
DATA TRANSFER RATE-MAX: 0.125 MBPS
EXTERNAL DATA BUS WIDTH: 16
JESD-30 CODE: S-CQFP-F72
JESD-609 CODE: E0
LENGTH: 25.4 MM
LOW POWER MODE: NO
MANUFACTURER: DATA DEVICE CORPORATION
MANUFACTURER PART NUMBER: BU-61864F3-270
NUMBER OF SERIAL I/OS: 2
NUMBER OF TERMINALS: 72
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: CERAMIC, METAL-SEALED COFIRED
PACKAGE CODE: QFF
PACKAGE DESCRIPTION: QFF, QFL72,1.0SQ
PACKAGE EQUIVALENCE CODE: QFL72,1.0SQ
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
PART PACKAGE CODE: QFP
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 72
POWER SUPPLIES: 3.3,5 V
QUALIFICATION STATUS: NOT QUALIFIED
SCREENING LEVEL: MIL-STD-883
SEATED HEIGHT-MAX: 3.94 MM
SUBCATEGORY: SERIAL IO/COMMUNICATION CONTROLLERS
SUPPLY VOLTAGE-MAX: 3.6 V
SUPPLY VOLTAGE-MIN: 3 V
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: HYBRID
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: FLAT
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 25.4 MM
UPS/UCS/PERIPHERAL ICS TYPE: SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
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