BU-61864F3-270

BU-61864F3-270

QFF, QFL72,1.0SQ

Call for availability

Manufactured by:

DATA DEVICE

Mfr Part#:  BU-61864F3-270

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  QFF

PACKAGE DESCRIPTION:  QFF, QFL72,1.0SQ

PACKAGE EQUIVALENCE CODE:  QFL72,1.0SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  16

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  20 MHZ

COMMUNICATION PROTOCOL:  MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760; MCAIR; STANAG-3838

DATA ENCODING/DECODING METHOD:  BIPH-LEVEL(MANCHESTER)

DATA TRANSFER RATE-MAX:  0.125 MBPS

EXTERNAL DATA BUS WIDTH:  16

JESD-30 CODE:  S-CQFP-F72

JESD-609 CODE:  E0

LENGTH:  25.4 MM

LOW POWER MODE:  NO

MANUFACTURER:  DATA DEVICE CORPORATION

MANUFACTURER PART NUMBER:  BU-61864F3-270

NUMBER OF SERIAL I/OS:  2

NUMBER OF TERMINALS:  72

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  QFF

PACKAGE DESCRIPTION:  QFF, QFL72,1.0SQ

PACKAGE EQUIVALENCE CODE:  QFL72,1.0SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  72

POWER SUPPLIES:  3.3,5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SCREENING LEVEL:  MIL-STD-883

SEATED HEIGHT-MAX:  3.94 MM

SUBCATEGORY:  SERIAL IO/COMMUNICATION CONTROLLERS

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  HYBRID

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  FLAT

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  25.4 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

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