FT245RL

FT245RL

Call for availability

Manufactured by:

FTDI

Mfr Part#:  FT245RL

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SSOP

PACKAGE DESCRIPTION:  ,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  SMALL OUTLINE, SHRINK PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PDSO-G28

LENGTH:  10.2 MM

MANUFACTURER:  FTDI CHIP

MANUFACTURER PART NUMBER:  FT245RL

NUMBER OF TERMINALS:  28

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SSOP

PACKAGE DESCRIPTION:  ,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  SMALL OUTLINE, SHRINK PITCH

PEAK REFLOW TEMPERATURE (CEL):  260

SEATED HEIGHT-MAX:  2 MM

SUPPLY VOLTAGE-MAX:  5.25 V

SUPPLY VOLTAGE-MIN:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  5.3 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR CIRCUIT

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