AM29LV010B-70EC

AM29LV010B-70EC

TSSOP, TSSOP32,.8,20

Call for availability

Manufactured by:

FUJITSU

Mfr Part#:  AM29LV010B-70EC

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP32,.8,20

PACKAGE EQUIVALENCE CODE:  TSSOP32,.8,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  70 NS

COMMAND USER INTERFACE:  YES

DATA POLLING:  YES

ENDURANCE:  1000000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PDSO-G32

MANUFACTURER:  FUJITSU SEMICONDUCTOR LIMITED

MANUFACTURER PART NUMBER:  AM29LV010B-70EC

MEMORY DENSITY:  1.0486 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  8

NUMBER OF SECTORS/SIZE:  8

NUMBER OF TERMINALS:  32

NUMBER OF WORDS:  131.072 K

NUMBER OF WORDS CODE:  128000

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  128KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP32,.8,20

PACKAGE EQUIVALENCE CODE:  TSSOP32,.8,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL/SERIAL:  PARALLEL

POWER SUPPLIES:  3/3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SECTOR SIZE:  16K

STANDBY CURRENT-MAX:  5 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  30 ΜA

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TOGGLE BIT:  YES

TYPE:  NOR TYPE

Related Products