AM29LV010B-70EC
TSSOP, TSSOP32,.8,20Call for availability
Mfr Part#: AM29LV010B-70EC
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP32,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP32,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 70 NS
COMMAND USER INTERFACE: YES
DATA POLLING: YES
ENDURANCE: 1000000 WRITE/ERASE CYCLES
JESD-30 CODE: R-PDSO-G32
MANUFACTURER: FUJITSU SEMICONDUCTOR LIMITED
MANUFACTURER PART NUMBER: AM29LV010B-70EC
MEMORY DENSITY: 1.0486 MBIT
MEMORY IC TYPE: FLASH
MEMORY WIDTH: 8
NUMBER OF SECTORS/SIZE: 8
NUMBER OF TERMINALS: 32
NUMBER OF WORDS: 131.072 K
NUMBER OF WORDS CODE: 128000
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 128KX8
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP32,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP32,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PARALLEL/SERIAL: PARALLEL
POWER SUPPLIES: 3/3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SECTOR SIZE: 16K
STANDBY CURRENT-MAX: 5 ΜA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 30 ΜA
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TOGGLE BIT: YES
TYPE: NOR TYPE
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