MB85R256HPF-G-BND-ERAE1

MB85R256HPF-G-BND-ERAE1

SOP, SOP28,.45

Call for availability

Manufactured by:

FUJITSU

Mfr Part#:  MB85R256HPF-G-BND-ERAE1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP28,.45

PACKAGE EQUIVALENCE CODE:  SOP28,.45

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  70 NS

JESD-30 CODE:  R-PDSO-G28

LENGTH:  17.75 MM

MANUFACTURER:  FUJITSU LIMITED

MANUFACTURER PART NUMBER:  MB85R256HPF-G-BND-ERAE1

MEMORY DENSITY:  262.144 KBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  32KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP28,.45

PACKAGE EQUIVALENCE CODE:  SOP28,.45

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.8 MM

STANDBY CURRENT-MAX:  50 ΜA

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  10 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  8.6 MM

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