MBM27C64-25

MBM27C64-25

WQCCN

Call for availability

Manufactured by:

FUJITSU

Mfr Part#:  MBM27C64-25

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  WQCCN

PACKAGE DESCRIPTION:  WQCCN,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  CHIP CARRIER, WINDOW

PART PACKAGE CODE:  QFJ

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  250 NS

JESD-30 CODE:  R-CQCC-N32

LENGTH:  13.97 MM

MANUFACTURER:  FUJITSU LIMITED

MANUFACTURER PART NUMBER:  MBM27C64-25

MEMORY DENSITY:  65.536 KBIT

MEMORY IC TYPE:  UVPROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  32

NUMBER OF WORDS:  8.192 K

NUMBER OF WORDS CODE:  8000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  8KX8

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  WQCCN

PACKAGE DESCRIPTION:  WQCCN,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  CHIP CARRIER, WINDOW

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFJ

PIN COUNT:  32

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  3.3 MM

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  QUAD

WIDTH:  11.43 MM

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