ACCESS TIME-MAX:  8.5 NS

ADDITIONAL FEATURE:  FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

CLOCK FREQUENCY-MAX (FCLK):  133 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-PBGA-B119

JESD-609 CODE:  E0

LENGTH:  22 MM

MANUFACTURER:  GSI TECHNOLOGY

MANUFACTURER PART NUMBER:  GS8162Z18B-133

MEMORY DENSITY:  18.8744 MBIT

MEMORY IC TYPE:  ZBT SRAM

MEMORY WIDTH:  18

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  119

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  1MX18

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA119,7X17,50

PACKAGE EQUIVALENCE CODE:  BGA119,7X17,50

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  119

POWER SUPPLIES:  2.5,2.5/3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.99 MM

STANDBY CURRENT-MAX:  20 MA

STANDBY VOLTAGE-MIN:  2.38 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  155 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  2.7 V

SUPPLY VOLTAGE-MIN (VSUP):  2.3 V

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM