GS840E18AGT-166

GS840E18AGT-166

LQFP, QFP100,.63X.87

Call for availability

Manufactured by:

GSI TECH

Mfr Part#:  GS840E18AGT-166

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LQFP

PACKAGE DESCRIPTION:  LQFP, QFP100,.63X.87

PACKAGE EQUIVALENCE CODE:  QFP100,.63X.87

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK, LOW PROFILE

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  8.5 NS

ADDITIONAL FEATURE:  FLOW-THROUGH OR PIPELINED ARCHITECTURE

CLOCK FREQUENCY-MAX (FCLK):  166 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-PQFP-G100

JESD-609 CODE:  E3

LENGTH:  20 MM

MANUFACTURER:  GSI TECHNOLOGY

MANUFACTURER PART NUMBER:  GS840E18AGT-166

MEMORY DENSITY:  4.7186 MBIT

MEMORY IC TYPE:  CACHE SRAM

MEMORY WIDTH:  18

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  100

NUMBER OF WORDS:  262.144 K

NUMBER OF WORDS CODE:  256000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  256KX18

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LQFP

PACKAGE DESCRIPTION:  LQFP, QFP100,.63X.87

PACKAGE EQUIVALENCE CODE:  QFP100,.63X.87

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK, LOW PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  100

POWER SUPPLIES:  2.5/3.3,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

STANDBY CURRENT-MAX:  20 MA

STANDBY VOLTAGE-MIN:  3.14 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  310 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  PURE MATTE TIN

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM

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