ACCESS TIME-MAX:  12 NS

ADDITIONAL FEATURE:  FLOW-THROUGH OR PIPELINED ARCHITECTURE

JESD-30 CODE:  R-PQFP-G100

JESD-609 CODE:  E3

LENGTH:  20 MM

MANUFACTURER:  GSI TECHNOLOGY

MANUFACTURER PART NUMBER:  GS841Z18AGT-100

MEMORY DENSITY:  4.7186 MBIT

MEMORY IC TYPE:  ZBT SRAM

MEMORY WIDTH:  18

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  100

NUMBER OF WORDS:  262.144 K

NUMBER OF WORDS CODE:  256000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  256KX18

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LQFP

PACKAGE DESCRIPTION:  LQFP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK, LOW PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  100

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  PURE MATTE TIN

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM