HT9170B

HT9170B

DIP, DIP18,.3

Call for availability

Manufactured by:

HOLTEK

Mfr Part#:  HT9170B

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDIP-T18

MANUFACTURER:  HOLTEK SEMICONDUCTOR INC

MANUFACTURER PART NUMBER:  HT9170B

NUMBER OF TERMINALS:  18

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  -20 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP18,.3

PACKAGE EQUIVALENCE CODE:  DIP18,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

POWER SUPPLIES:  3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  TELECOM SIGNALING CIRCUITS

SUPPLY CURRENT-MAX:  7 MA

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TELECOM IC TYPE:  DTMF SIGNALING CIRCUIT

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

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