BGM1033N7E6327
HVSONCall for availability
Manufactured by:
Mfr Part#: BGM1033N7E6327
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HVSON
PACKAGE DESCRIPTION: HVSON,
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: R-PDSO-N6
LENGTH: 2.3 MM
MANUFACTURER: INFINEON TECHNOLOGIES AG
MANUFACTURER PART NUMBER: BGM1033N7E6327
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 6
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HVSON
PACKAGE DESCRIPTION: HVSON,
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
SEATED HEIGHT-MAX: 770 ΜM
SUPPLY VOLTAGE-NOM: 2.7 V
SURFACE MOUNT: YES
TELECOM IC TYPE: TELECOM CIRCUIT
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: NO LEAD
TERMINAL PITCH: 540 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 1.7 MM
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