ACCESS TIME-MAX:  6.5 NS

CLOCK FREQUENCY-MAX (FCLK):  133 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  2,4,8,16

JESD-30 CODE:  R-PBGA-B60

MANUFACTURER:  INFINEON TECHNOLOGIES AG

MANUFACTURER PART NUMBER:  HYB18M512160AF-7.5

MEMORY DENSITY:  536.8709 MBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  16

NUMBER OF TERMINALS:  60

NUMBER OF WORDS:  33.5544 M

NUMBER OF WORDS CODE:  32000000

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  32MX16

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FBGA

PACKAGE DESCRIPTION:  FBGA, BGA60,9X10,32

PACKAGE EQUIVALENCE CODE:  BGA60,9X10,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, FINE PITCH

POWER SUPPLIES:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  8192

SEQUENTIAL BURST LENGTH:  2,4,8,16

STANDBY CURRENT-MAX:  500 ΜA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  90 ΜA

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM