HYB25D256160CEL-6

HYB25D256160CEL-6

TSOP2

Call for availability

Manufactured by:

INFINEON TECHNOLOGIES

Mfr Part#:  HYB25D256160CEL-6

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP2

PACKAGE DESCRIPTION:  TSOP2,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PART PACKAGE CODE:  TSOP2

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS MODE:  FOUR BANK PAGE BURST

ACCESS TIME-MAX:  700 PS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

JESD-30 CODE:  R-PDSO-G66

JESD-609 CODE:  E3

LENGTH:  22.22 MM

MANUFACTURER:  INFINEON TECHNOLOGIES AG

MANUFACTURER PART NUMBER:  HYB25D256160CEL-6

MEMORY DENSITY:  268.4355 MBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  66

NUMBER OF WORDS:  16.7772 M

NUMBER OF WORDS CODE:  16000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  16MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP2

PACKAGE DESCRIPTION:  TSOP2,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PART PACKAGE CODE:  TSOP2

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  66

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  2.7 V

SUPPLY VOLTAGE-MIN (VSUP):  2.3 V

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  MATTE TIN

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  10.16 MM

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