HYB39L128160AC-8
TFBGA, BGA54,9X9,32Call for availability
Mfr Part#: HYB39L128160AC-8
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA54,9X9,32
PACKAGE EQUIVALENCE CODE: BGA54,9X9,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS MODE: FOUR BANK PAGE BURST
ACCESS TIME-MAX: 6 NS
ADDITIONAL FEATURE: AUTO/SELF REFRESH
CLOCK FREQUENCY-MAX (FCLK): 125 MHZ
I/O TYPE: COMMON
INTERLEAVED BURST LENGTH: 1,2,4,8
JESD-30 CODE: R-PBGA-B54
JESD-609 CODE: E0
LENGTH: 9 MM
MANUFACTURER: INFINEON TECHNOLOGIES AG
MANUFACTURER PART NUMBER: HYB39L128160AC-8
MEMORY DENSITY: 134.2177 MBIT
MEMORY IC TYPE: SYNCHRONOUS DRAM
MEMORY WIDTH: 16
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 1
NUMBER OF TERMINALS: 54
NUMBER OF WORDS: 8.3886 M
NUMBER OF WORDS CODE: 8000000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 8MX16
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA54,9X9,32
PACKAGE EQUIVALENCE CODE: BGA54,9X9,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 54
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
REFRESH CYCLES: 4096
SEATED HEIGHT-MAX: 1.2 MM
SEQUENTIAL BURST LENGTH: 1,2,4,8,FP
STANDBY CURRENT-MAX: 400 ΜA
SUBCATEGORY: DRAMS
SUPPLY CURRENT-MAX: 150 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 3 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: BALL
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 8 MM
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