71V65903S75PF

71V65903S75PF

LQFP, QFP100,.63X.87

Call for availability

Manufactured by:

INTEGRATED DEVICE TECHNOLOGY

Mfr Part#:  71V65903S75PF

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LQFP

PACKAGE DESCRIPTION:  LQFP, QFP100,.63X.87

PACKAGE EQUIVALENCE CODE:  QFP100,.63X.87

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK, LOW PROFILE

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  7.5 NS

ADDITIONAL FEATURE:  FLOW-THROUGH ARCHITECTURE

CLOCK FREQUENCY-MAX (FCLK):  100 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-PQFP-G100

JESD-609 CODE:  E0

LENGTH:  20 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  71V65903S75PF

MEMORY DENSITY:  9.4372 MBIT

MEMORY IC TYPE:  ZBT SRAM

MEMORY WIDTH:  18

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  100

NUMBER OF WORDS:  524.288 K

NUMBER OF WORDS CODE:  512000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  512KX18

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LQFP

PACKAGE DESCRIPTION:  LQFP, QFP100,.63X.87

PACKAGE EQUIVALENCE CODE:  QFP100,.63X.87

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK, LOW PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  100

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

STANDBY CURRENT-MAX:  40 MA

STANDBY VOLTAGE-MIN:  3.14 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  275 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.465 V

SUPPLY VOLTAGE-MIN (VSUP):  3.135 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN85PB15)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  14 MM

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