CA91L8200B-100CL
HBGACall for availability
Manufactured by:
Mfr Part#: CA91L8200B-100CL
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HBGA
PACKAGE DESCRIPTION: HBGA,
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, HEAT SINK/SLUG
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDRESS BUS WIDTH: 32
BUS COMPATIBILITY: MPC8260; POWERPC 603E; POWERPC 7400; POWERPC 740; POWERPC 750
CLOCK FREQUENCY-MAX: 100 MHZ
EXTERNAL DATA BUS WIDTH: 64
JESD-30 CODE: S-PBGA-B504
LENGTH: 27 MM
MANUFACTURER: INTEGRATED DEVICE TECHNOLOGY INC
MANUFACTURER PART NUMBER: CA91L8200B-100CL
NUMBER OF TERMINALS: 504
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HBGA
PACKAGE DESCRIPTION: HBGA,
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, HEAT SINK/SLUG
PART PACKAGE CODE: BGA
PIN COUNT: 504
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.36 MM
SUPPLY VOLTAGE-MAX: 2.63 V
SUPPLY VOLTAGE-MIN: 2.38 V
SUPPLY VOLTAGE-NOM: 2.5 V
SURFACE MOUNT: YES
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM
WIDTH: 27 MM
UPS/UCS/PERIPHERAL ICS TYPE: BUS CONTROLLER, PCI
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