ICS1889Y

ICS1889Y

QFP

Call for availability

Manufactured by:

INTEGRATED DEVICE TECHNOLOGY

Mfr Part#:  ICS1889Y

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  0

BOUNDARY SCAN:  NO

DATA ENCODING/DECODING METHOD:  NRZI

DATA TRANSFER RATE-MAX:  12.5 MBPS

EXTERNAL DATA BUS WIDTH:  0

JESD-30 CODE:  S-PQFP-G52

JESD-609 CODE:  E0

LENGTH:  14 MM

LOW POWER MODE:  YES

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  ICS1889Y

NUMBER OF DMA CHANNELS:  0

NUMBER OF I/O LINES:  0

NUMBER OF SERIAL I/OS:  1

NUMBER OF TERMINALS:  52

ON CHIP DATA RAM WIDTH:  0

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  52

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  0

SEATED HEIGHT-MAX:  2.45 MM

SUPPLY CURRENT-MAX:  80 MA

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, LAN

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