IDT70V05S25PFG
LQFP, QFP64,.66SQ,32Call for availability
Mfr Part#: IDT70V05S25PFG
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LQFP
PACKAGE DESCRIPTION: LQFP, QFP64,.66SQ,32
PACKAGE EQUIVALENCE CODE: QFP64,.66SQ,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 25 NS
ADDITIONAL FEATURE: INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
I/O TYPE: COMMON
JESD-30 CODE: S-PQFP-G64
JESD-609 CODE: E3
LENGTH: 14 MM
MANUFACTURER: INTEGRATED DEVICE TECHNOLOGY INC
MANUFACTURER PART NUMBER: IDT70V05S25PFG
MEMORY DENSITY: 65.536 KBIT
MEMORY IC TYPE: DUAL-PORT SRAM
MEMORY WIDTH: 8
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 64
NUMBER OF WORDS: 8.192 K
NUMBER OF WORDS CODE: 8000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 8KX8
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LQFP
PACKAGE DESCRIPTION: LQFP, QFP64,.66SQ,32
PACKAGE EQUIVALENCE CODE: QFP64,.66SQ,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: QFP
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 64
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.6 MM
STANDBY CURRENT-MAX: 5 MA
STANDBY VOLTAGE-MIN: 3 V
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 190 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 3 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: MATTE TIN (SN) - ANNEALED
TERMINAL FORM: GULL WING
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 14 MM
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