IDT70V261L25PFI
LFQFP, QFP100,.63SQ,20Call for availability
Mfr Part#: IDT70V261L25PFI
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP100,.63SQ,20
PACKAGE EQUIVALENCE CODE: QFP100,.63SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 25 NS
ADDITIONAL FEATURE: INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
I/O TYPE: COMMON
JESD-30 CODE: S-PQFP-G100
JESD-609 CODE: E0
LENGTH: 14 MM
MANUFACTURER: INTEGRATED DEVICE TECHNOLOGY INC
MANUFACTURER PART NUMBER: IDT70V261L25PFI
MEMORY DENSITY: 262.144 KBIT
MEMORY IC TYPE: DUAL-PORT SRAM
MEMORY WIDTH: 16
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 100
NUMBER OF WORDS: 16.384 K
NUMBER OF WORDS CODE: 16000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 16KX16
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP100,.63SQ,20
PACKAGE EQUIVALENCE CODE: QFP100,.63SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: QFP
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): 240
PIN COUNT: 100
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.6 MM
STANDBY CURRENT-MAX: 3 MA
STANDBY VOLTAGE-MIN: 3 V
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 185 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 3 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN85PB15)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 20
WIDTH: 14 MM
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