IDT70V3379S4BF
TFBGA, BGA208,17X17,32Call for availability
Mfr Part#: IDT70V3379S4BF
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA208,17X17,32
PACKAGE EQUIVALENCE CODE: BGA208,17X17,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 4.2 NS
ADDITIONAL FEATURE: PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE
CLOCK FREQUENCY-MAX (FCLK): 133 MHZ
I/O TYPE: COMMON
JESD-30 CODE: S-PBGA-B208
JESD-609 CODE: E0
LENGTH: 15 MM
MANUFACTURER: INTEGRATED DEVICE TECHNOLOGY INC
MANUFACTURER PART NUMBER: IDT70V3379S4BF
MEMORY DENSITY: 589.824 KBIT
MEMORY IC TYPE: DUAL-PORT SRAM
MEMORY WIDTH: 18
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 208
NUMBER OF WORDS: 32.768 K
NUMBER OF WORDS CODE: 32000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 32KX18
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA208,17X17,32
PACKAGE EQUIVALENCE CODE: BGA208,17X17,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: BGA
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): 225
PIN COUNT: 208
POWER SUPPLIES: 2.5/3.3,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.2 MM
STANDBY CURRENT-MAX: 15 MA
STANDBY VOLTAGE-MIN: 3.15 V
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 460 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.45 V
SUPPLY VOLTAGE-MIN (VSUP): 3.15 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN63PB37)
TERMINAL FORM: BALL
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 20
WIDTH: 15 MM
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