IDT70V5388S133BGI
BGA, BGA272,20X20,50Call for availability
Mfr Part#: IDT70V5388S133BGI
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA272,20X20,50
PACKAGE EQUIVALENCE CODE: BGA272,20X20,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 3.4 NS
ADDITIONAL FEATURE: PIPELINED ARCHITECTURE
CLOCK FREQUENCY-MAX (FCLK): 133 MHZ
I/O TYPE: COMMON
JESD-30 CODE: S-PBGA-B272
JESD-609 CODE: E0
LENGTH: 27 MM
MANUFACTURER: INTEGRATED DEVICE TECHNOLOGY INC
MANUFACTURER PART NUMBER: IDT70V5388S133BGI
MEMORY DENSITY: 1.1796 MBIT
MEMORY IC TYPE: FOUR-PORT SRAM
MEMORY WIDTH: 18
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 4
NUMBER OF TERMINALS: 272
NUMBER OF WORDS: 65.536 K
NUMBER OF WORDS CODE: 64000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 64KX18
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA272,20X20,50
PACKAGE EQUIVALENCE CODE: BGA272,20X20,50
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: BGA
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 272
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.54 MM
STANDBY CURRENT-MAX: 15 MA
STANDBY VOLTAGE-MIN: 3.15 V
SUBCATEGORY: SRAMS
SUPPLY CURRENT-MAX: 325 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.45 V
SUPPLY VOLTAGE-MIN (VSUP): 3.15 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN63PB37)
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
WIDTH: 27 MM
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