ACCESS TIME-MAX:  3.1 NS

ADDITIONAL FEATURE:  PIPELINED ARCHITECTURE

CLOCK FREQUENCY-MAX (FCLK):  200 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-PBGA-B119

JESD-609 CODE:  E0

LENGTH:  22 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT71V35761S200BG

MEMORY DENSITY:  4.7186 MBIT

MEMORY IC TYPE:  CACHE SRAM

MEMORY WIDTH:  36

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  119

NUMBER OF WORDS:  131.072 K

NUMBER OF WORDS CODE:  128000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  128KX36

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA119,7X17,50

PACKAGE EQUIVALENCE CODE:  BGA119,7X17,50

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  119

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.36 MM

STANDBY CURRENT-MAX:  30 MA

STANDBY VOLTAGE-MIN:  3.14 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  360 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.465 V

SUPPLY VOLTAGE-MIN (VSUP):  3.135 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN63PB37)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM