ACCESS TIME-MAX:  10 NS

I/O TYPE:  COMMON

JESD-30 CODE:  S-PBGA-B48

JESD-609 CODE:  E0

LENGTH:  9 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT71V416L10BE

MEMORY DENSITY:  4.1943 MBIT

MEMORY IC TYPE:  STANDARD SRAM

MEMORY WIDTH:  16

MOISTURE SENSITIVITY LEVEL:  4

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  48

NUMBER OF WORDS:  262.144 K

NUMBER OF WORDS CODE:  256000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  256KX16

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA48,6X8,30

PACKAGE EQUIVALENCE CODE:  BGA48,6X8,30

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  48

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

STANDBY CURRENT-MAX:  10 MA

STANDBY VOLTAGE-MIN:  3 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  180 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN63PB37)

TERMINAL FORM:  BALL

TERMINAL PITCH:  750 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  9 MM