IDT7281L15PAGI

IDT7281L15PAGI

TSSOP, TSSOP56,.3,20

Call for availability

Manufactured by:

INTEGRATED DEVICE TECHNOLOGY

Mfr Part#:  IDT7281L15PAGI

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP56,.3,20

PACKAGE EQUIVALENCE CODE:  TSSOP56,.3,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  15 NS

ADDITIONAL FEATURE:  RETRANSMIT

CLOCK FREQUENCY-MAX (FCLK):  40 MHZ

CYCLE TIME:  25 NS

JESD-30 CODE:  R-PDSO-G56

JESD-609 CODE:  E3

LENGTH:  14 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT7281L15PAGI

MEMORY DENSITY:  4.608 KBIT

MEMORY IC TYPE:  OTHER FIFO

MEMORY WIDTH:  9

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  56

NUMBER OF WORDS:  512 WORDS

NUMBER OF WORDS CODE:  512

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  512X9

OUTPUT ENABLE:  NO

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP56,.3,20

PACKAGE EQUIVALENCE CODE:  TSSOP56,.3,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  TSSOP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  56

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

STANDBY CURRENT-MAX:  15 MA

SUBCATEGORY:  FIFOS

SUPPLY CURRENT-MAX:  125 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN (SN) - ANNEALED

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  6.1 MM

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