IDT72V825L15PF

IDT72V825L15PF

LFQFP, QFP128,.63X.87,20

Call for availability

Manufactured by:

INTEGRATED DEVICE TECHNOLOGY

Mfr Part#:  IDT72V825L15PF

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP128,.63X.87,20

PACKAGE EQUIVALENCE CODE:  QFP128,.63X.87,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  10 NS

CLOCK FREQUENCY-MAX (FCLK):  66.7 MHZ

CYCLE TIME:  15 NS

JESD-30 CODE:  R-PQFP-G128

JESD-609 CODE:  E0

LENGTH:  20 MM

MANUFACTURER:  INTEGRATED DEVICE TECHNOLOGY INC

MANUFACTURER PART NUMBER:  IDT72V825L15PF

MEMORY DENSITY:  18.432 KBIT

MEMORY IC TYPE:  OTHER FIFO

MEMORY WIDTH:  18

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  128

NUMBER OF WORDS:  1.024 K

NUMBER OF WORDS CODE:  1000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  1KX18

OUTPUT ENABLE:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP128,.63X.87,20

PACKAGE EQUIVALENCE CODE:  QFP128,.63X.87,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  128

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

STANDBY CURRENT-MAX:  10 MA

SUBCATEGORY:  FIFOS

SUPPLY CURRENT-MAX:  60 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN85PB15)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  14 MM

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